• Study level

    BAC +4

  • ECTS

    10 credits

  • Component

    Faculty of Science

  • Hourly volume

    66h

Description

This module focuses on the physical understanding of light emission and absorption processes in semiconductor devices, and on the technologies used to manufacture such devices. These issues are put into practice in the cleanroom project, with the production and characterization of an optoelectronic component.

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Objectives

- Master the concepts and theories of optoelectronic semiconductor component physics

- Master the development of materials and components through the implementation of different technological stages, as well as their modeling.

- Implement experimental cleanroom manufacturing and characterization techniques; work in a cleanroom environment (safety, constraints, etc.).

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Necessary prerequisites

Condensed matter physics; Component physics and technology (HAP711P)

Recommended prerequisites:

Quantum mechanics; Statistical physics

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Knowledge control

Full continuous assessment

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Syllabus

1) Physics of optoelectronic semiconductor components :

- Light emitters and receivers: what's at stake?

- Optical properties of semiconductors

- Quantum confinement in heterostructures

- Photonics for optoelectronics

- Optoelectronic components :

- LEDs, laser diodes, amplifiers, modulators

- Sensors

- Focus: VCSEL III-V technology

2) Materials and components development (Technology 2/3)

- Growth of materials: principles, mechanisms and techniques

- Physical mechanisms common to all growth techniques

- Solid material growth and shaping, from ingot to wafer

- Thin films (epitaxial or polycrystalline): from a gas phase, assisted or not by plasma (CVD...), sputtering, evaporation, high-vacuum growth (sputtering, magnetron, RF - thermal evaporation or electron beam)

- In-situ doping

- Other technological processes :

- state of the art in lithography (optical, electronic, extreme UV...) and etching (dry and wet)

- thermal oxidation (Deal-Grove and Massoud models)

- grinding (slimming), planarization (CMP)

3) Clean room project: optoelectronic component production + optical characterization

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