Level of Education
4-year college degree
ECTS
10 credits
Training Structure
College of Sciences
Number of hours
66h
Description
This module focuses, on the one hand, on the physical understanding of light emission and absorption processes in semiconductor devices, and, on the other hand, on the technologies used to manufacture such devices. These topics are applied in the cleanroom project, which involves the fabrication and subsequent characterization of an optoelectronic component.
Objectives
- Master the concepts and theories of the physics of semiconductor optoelectronic components
- Master the development of materials and components through the implementation of various technological processes, as well as their modeling
- Implement experimental cleanroom manufacturing and characterization techniques; work in a cleanroom-type environment (safety, constraints, etc.).
Mandatory Prerequisites
Condensed Matter Physics; Physics and Technology of Components (HAP711P)
Recommended prerequisites:
Quantum Mechanics; Statistical Physics
Knowledge Assessment
Comprehensive Continuous Monitoring
Course Outline
1) Physics of semiconductor optoelectronic components:
- Light Emitters and Receivers: What Are the Challenges?
- Optical Properties of Semiconductors
- Quantum confinement in heterostructures
- Photonics for Optoelectronics
- Optoelectronic components:
- LEDs, laser diodes, amplifiers, modulators
- Sensors
- Focus: III-V VCSEL Technology
2) Development of Materials and Components (Technology 2/3)
- Materials Growth: Principles, Mechanisms, and Techniques
· Physical mechanisms common to all growth techniques
· Bulk material growth and processing, from ingot to wafer
· Thin films (epitaxial or polycrystalline): deposited from a gaseous phase, with or without plasma assistance (CVD, etc.), by sputtering, evaporation, or growth in a high-vacuum environment (cathodic sputtering, magnetron sputtering, RF thermal evaporation, or electron beam evaporation)
· In-situ doping
- Other technological processes:
· State of the art in lithography (optical, electronic, extreme UV, etc.) and etching (dry and wet)
· thermal oxidation (Deal-Grove and Massoud models)
· grinding (thinning), planarization (CMP)
3) Cleanroom Project: Fabrication of optoelectronic components + optical characterization