• Level of education

    Bachelor's degree

  • ECTS

    10 credits

  • Training structure

    Faculty of Science

  • Hours per week

    66h

Description

This module focuses on understanding the physical processes involved in light emission and absorption in semiconductor devices, as well as the technologies used to manufacture such devices. These issues are addressed in the clean room project, which involves the production and characterization of an optoelectronic component.

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Objectives

- Master the concepts and theories of the physics of semiconductor optoelectronic components

- Mastering the development of materials and components through the implementation of various technological stages, as well as their modeling

- Implement experimental cleanroom manufacturing and characterization techniques; work in a cleanroom environment (safety, constraints, etc.).

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Mandatory prerequisites

Condensed Matter Physics; Physics and Technology of Components (HAP711P)

Recommended prerequisites:

Quantum mechanics; Statistical physics

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Knowledge assessment

Continuous assessment

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Syllabus

1) Physics of semiconductor optoelectronic components:

- Light emitters and receivers: what are the challenges?

- Optical properties of semiconductors

- Quantum confinement in heterostructures

- Photonics for optoelectronics

- Optoelectronic components:

- LEDs, laser diodes, amplifiers, modulators

- Detectors

- Focus: III-V VCSEL Technology

2) Development of materials and components (Technology 2/3)

- Material growth: principles, mechanisms, and techniques

· Physical mechanisms common to all growth techniques

· Mass material growth and shaping, from ingot to wafer

· Thin films (epitaxial or polycrystalline): from a gas phase, with or without plasma assistance (CVD, etc.), spraying, evaporation, high vacuum growth (sputtering, magnetron, RF—thermal evaporation or electron beam evaporation)

· In-situ doping

- Other technological processes:

· State of the art in lithography (optical, electronic, extreme UV, etc.) and etching (dry and wet)

· thermal oxidation (Deal-Grove and Massoud models)

· grinding (thinning), planarization (CMP)

3) Clean room project: Production of optoelectronic components + optical characterization

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