Physics and Technology of Components

This module covers the fundamentals of the physics and technology of semiconductor-based components. Most of the course unit focuses on the physics of the components. Drawing on the equations that describe the properties of materials, the main types of junctions are examined (p/n, metal/semiconductor, MIS). Based on this knowledge, the operation of basic components (diodes, transistors) is explained. In the second part, the fundamental building blocks of component manufacturing processes are presented.

- Apply fundamental concepts to model and analyze the operation of semiconductor-based electronic components.

- Propose a protocol, then conduct experimental measurements to characterize a component, interpret the results, and derive the relevant parameters.

- Propose a procedure for building a simple photodiode-type device.

Recommended prerequisites:

Condensed Matter Physics

CCI

This module focuses primarily on the physics of semiconductor-based components. First, the equations governing the behavior of semiconductor materials are presented. The behavior of three types of junctions (p/n, metal-semiconductor, and metal-insulator-semiconductor) is then studied in detail, both in equilibrium and out of equilibrium. Based on the equations describing the behavior of junctions, equations describing the operation of basic components—diodes (p/n, Schottky, MOS) and transistors (bipolar, JFET, MESFET, MOSFET)—are derived. Standard methods for characterizing these components are presented in conjunction with an experimental component that takes place in the Experimental Physics module.

In addition, this course includes an introduction to the technologies used in the development of semiconductor-based devices. Following a brief historical overview to provide context, it includes a quick introduction to the work environment (cleanroom) and the various technological steps involved. In preparation for the first cleanroom assignment (lab work) taking place at the beginning of the second semester (HAP810P), greater emphasis is placed on photolithography, etching (wet and dry), and metallization. The other techniques will be covered in greater depth in the HAP810P and HAP928P courses.

Junction Physics and Applications

SC in equilibrium and out of equilibrium

Equilibrium/Biased p-n Junction – Light-Emitting Diode, Photodiode

Metal-SC contact, Schottky diode

Contact MIS

Bipolar transistors

Unipolar Transistors – J-FET, MESFET, MOSFET

Overview of the Main Characterization Techniques

Technological Processes 1/3:

History and Overview of the Microelectronics Industry

Introduction to Microelectronics and Cleanroom Technologies

Optical lithography

Metal Evaporation – Basics

Chemical Etching