Level of education
Bachelor's degree
ECTS
8 credits
Training structure
Faculty of Science
Hours per week
66h
Description
This module covers the fundamentals of physics and technology of semiconductor-based components. Most of the course focuses on component physics. Based on equations describing material properties, the main types of junctions are examined (p/n, metal/SC, MIS). Based on this knowledge, the operation of elementary components (diodes, transistors) is explained. In the second part, the first building blocks of component manufacturing process technology are presented.
Objectives
- Apply fundamental concepts to model and analyze the operation of semiconductor-based electronic components.
- Propose a protocol, then carry out experimental measurements to characterize a component, interpret them, and deduce the relevant parameters.
- Propose a protocol for creating a simple photodiode-type device.
Mandatory prerequisites
Recommended prerequisites:
Condensed matter physics
Knowledge assessment
CCI
Syllabus
This module focuses primarily on the physics of semiconductor-based components. First, the equations governing the behavior of semiconductor materials are presented. The case of three types of junctions (p/n, metal-semiconductor, metal-insulator-semiconductor) is then studied in detail in equilibrium and out of equilibrium. Based on the equations describing the behavior of junctions, those describing the operation of basic components (diodes (p/n, Schottky, MOS), transistors (bipolar, JFET, MESFET, MOSFET)) are established. The usual methods for characterizing these components are presented in connection with an experimental part that takes place in the Experimental Physics module.
In addition, this course includes an introduction to the technologies used in the development of semiconductor-based devices. After a brief historical overview, it includes a quick presentation of the working environment (clean room) and the different technological stages. With a view to the first clean room work (practical work) taking place at the beginning of the second semester (HAP810P), there is a stronger focus on photolithography, etching (humic and dry) and metallization. The other techniques will be explored in greater depth in the HAP810P and HAP928P courses.
Junction Physics and Applications
SC in equilibrium and out of equilibrium
Equilibrium/polarized p-n junction – Light-emitting diode, photodiode
Metal-SC contact, Schottky diode
Contact MIS
Bipolar transistors
Unipolar transistor – J-FET, MESFET, MOSFET
Presentation of the main characterization techniques
Technological Processes 1/3:
History and overview of the microelectronics industry
Introduction to Microelectronics and Clean Room Technologies
Optical lithography
Metal evaporation – bases
Chemical etching