• Level of education

    Bachelor's degree

  • ECTS

    8 credits

  • Training structure

    Faculty of Science

  • Hours per week

    66h

Description

This module covers the fundamentals of physics and technology of semiconductor-based components. Most of the course focuses on component physics. Based on equations describing material properties, the main types of junctions are examined (p/n, metal/SC, MIS). Based on this knowledge, the operation of elementary components (diodes, transistors) is explained. In the second part, the first building blocks of component manufacturing process technology are presented.

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Objectives

- Apply fundamental concepts to model and analyze the operation of semiconductor-based electronic components.

- Propose a protocol, then carry out experimental measurements to characterize a component, interpret them, and deduce the relevant parameters.

- Propose a protocol for creating a simple photodiode-type device.

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Mandatory prerequisites

Recommended prerequisites:

Condensed matter physics

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Knowledge assessment

Syllabus

This module focuses primarily on the physics of semiconductor-based components. First, the equations governing the behavior of semiconductor materials are presented. The case of three types of junctions (p/n, metal-semiconductor, metal-insulator-semiconductor) is then studied in detail in equilibrium and out of equilibrium. Based on the equations describing the behavior of junctions, those describing the operation of basic components (diodes (p/n, Schottky, MOS), transistors (bipolar, JFET, MESFET, MOSFET)) are established. The usual methods for characterizing these components are presented in connection with an experimental part that takes place in the Experimental Physics module.

In addition, this course includes an introduction to the technologies used in the development of semiconductor-based devices. After a brief historical overview, it includes a quick presentation of the working environment (clean room) and the different technological stages. With a view to the first clean room work (practical work) taking place at the beginning of the second semester (HAP810P), there is a stronger focus on photolithography, etching (humic and dry) and metallization. The other techniques will be explored in greater depth in the HAP810P and HAP928P courses.

Junction Physics and Applications

SC in equilibrium and out of equilibrium

Equilibrium/polarized p-n junction – Light-emitting diode, photodiode

Metal-SC contact, Schottky diode

Contact MIS

Bipolar transistors

Unipolar transistor – J-FET, MESFET, MOSFET

Presentation of the main characterization techniques

Technological Processes 1/3:

History and overview of the microelectronics industry

Introduction to Microelectronics and Clean Room Technologies

Optical lithography

Metal evaporation – bases

Chemical etching

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