Training Structure
College of Sciences
Program
Optional
French as a Foreign Language
5 credits
EU OPTION 1 RADMEP
10 creditsChoose 2 out of 4
Optical and thermal sensors
5 creditsEntrepreneurship and Digital Innovation
5 creditsSystem-on-Chip and Embedded Systems Architecture
5 creditsAcoustic sensors syst
5 credits
Industrial Methods and Tools for Qualifying
3 creditsTesting and Reliability of Integrated Circuits and Systems
5 creditsWorkshop #3: CERN:
3 creditsEmbedded Electronics and Communications
6 creditsRadiation and Reliability of Electronics for Transportation, Aerospace, and Nuclear Applications
3 credits
RADMEP M2 Internship
30 credits
French as a Foreign Language
ECTS
5 credits
Training Structure
College of Sciences
EU OPTION 1 RADMEP
ECTS
10 credits
Training Structure
College of Sciences
Optical and thermal sensors
ECTS
5 credits
Training Structure
College of Sciences
Entrepreneurship and Digital Innovation
ECTS
5 credits
Training Structure
College of Sciences
System-on-Chip and Embedded Systems Architecture
ECTS
5 credits
Training Structure
College of Sciences
This course covers a broad range of topics, from the fundamentals of Boolean logic to the architecture of systems-on-chip (SoC), including logic synthesis flows, processor architecture, and the basics of embedded software. VHDL, a hardware description language, also plays a significant role in this course unit and will be studied in lectures and used in lab sessions, as well as in the context of an “Embedded Systems” project.
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This course covers a wide range of topics, from the fundamentals of Boolean logic to digital SoC (Systems-on-Chip) architecture, including digital design flows, computer architecture, and the basics of embedded software. VHDL will be covered in this course for both logic synthesis and modeling/simulation purposes. Lab sessions include hands-on VHDL exercises (design of a simple stack processor), and a student project on “Embedded Systems” allows students to deepen their knowledge in this area.
Acoustic sensors syst
ECTS
5 credits
Training Structure
College of Sciences
Industrial Methods and Tools for Qualifying
ECTS
3 credits
Training Structure
College of Sciences
Testing and Reliability of Integrated Circuits and Systems
ECTS
5 credits
Training Structure
College of Sciences
- Testing of digital integrated circuits.
- Types of errors.
- Generation of test vectors.
- Design for Test (DFT).
- Self-Contained Built-In Test (BIST).
- Testing Analog Integrated Circuits.
- Industrial testing (functional and parametric tests, characterization).
Workshop #3: CERN:
ECTS
3 credits
Training Structure
College of Sciences
Embedded Electronics and Communications
ECTS
6 credits
Training Structure
College of Sciences
This course is divided into three parts, including the IoT section, which will be taught by an industry professional in the field.
Wireless Sensors Section
- Various types of wireless sensors,
- Reminder about communications
(Technology, related electronics, how to make a choice based on specifications)
- RFID and sensors.
- Sensor networks
(Overview, physical layer and hardware architecture, example of the Internet of Things).
- A mini-project will be proposed.
Internet of Things (IoT) Section
- Description of connected devices
- Communication protocols: BLE, LoRa, NB-IoT, 5G
- IoT Electronic Architecture
- Energy consumption management
- Defining the antenna and the range of the systems
- Applications (autonomous vehicles, smart buildings, digital factories)
LabVIEW Section
- Summary of LabVIEW Basics
- Project management, executable generation, advanced programming (events, execution speed, memory management, waveform manipulation, etc.)
- Advanced data acquisition techniques, implementation of signal processing libraries
- Internet tools (email, web, remote control, etc.), MATSCRIPT/MATLAB
- IMAQ Vision (real-time image and video acquisition, image processing)
- LabVIEW Embedded Systems Programming
Radiation and Reliability of Electronics for Transportation, Aerospace, and Nuclear Applications
ECTS
3 credits
Training Structure
College of Sciences
- Understand the characteristics of radiation environments in space and avionics, the relevant quantities, and the interaction between radiation and matter
- Understand and evaluate the various effects of radiation on electronic components and systems.
- Know and understand testing methods
- Understanding future industrial challenges: the reliability of electric and autonomous vehicles, press facilities, nuclear decommissioning, etc.
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- Understand the characteristics of space and avionics radiative environments, key parameters, and the interaction between radiation and matter
- Understand and evaluate the various effects of radiation on electronic components and systems.
- Know and understand test methods
- understand future industrial challenges: the reliability of electric and autonomous vehicles, NewSpace, nuclear decommissioning, …
RADMEP M2 Internship
ECTS
30 credits
Training Structure
College of Sciences