Measurement and Imaging in Mechanical R&D

Field measurements are increasingly used in engineering, particularly in Mechanics. The aim of this module is to introduce the basics of different imaging methods, using image interpretation models of increasing complexity.

We begin by defining the operating principles of imaging devices, then introduce some mathematical morphology tools for extracting statistical information about quantities of a geometric nature.

We then look at infrared thermography methods through two interpretation models: camera calibration and inversion of the thermal problem to access heat sources.

Finally, Image Correlation methods are presented, with emphasis on the various underlying interpretation models (camera, transformation, conservation of optical flow, likelihood criterion).The course concludes with a comparison between experimental measurements and a numerical model, using a finite-element model recalibration method.Theoretical lectures are backed up by practical work sessions to apply processing methods and illustrate the influence of the main analysis parameters.

• Understanding the operating principles of imaging devices
• Know some mathematical morphology tools to extract statistical information on geometric quantities.
• Know the infrared thermography methods used in materials thermomechanics.
• Build an IR camera calibration model
• Raising awareness of the need to reverse the thermal problem in order to access heat sources.
• Learn the basics of the Digital Image Correlation method, with emphasis on the various underlying interpretation models (camera, transformation, conservation of optical flow, likelihood criterion).
• Compare experimental measurements with a numerical model using a finite-element model recalibration method.
• Apply these measurement and processing methods in practical sessions, illustrating the influence of the main analysis parameters.

Finite element simulation

HAY501Y Strength of materials

HAY503Y Rheology of materials

CCI

Recommended prerequisites* :

 Coupled Mechanical Behaviors I (UE Polytech)

 Coupled Mechanical Behaviors II (UE Polytech)